| 摘要 |
A semiconductor device is provided to improve the degree of freedom in designing a wiring by changing the layout of the wiring and the pad of an interposer. An outer connector is connected to a rear surface of a wiring board(2). A memory chip(M1-M4) is mounted on a main surface of the wiring board. A controller chip(3) controls the memory chip. An interposer(4) is mounted on the memory chip. The interposer is electrically connected to the controller chip. A first terminal is formed in a first side of the memory chip. A second terminal is formed in the first side of the interposer. A second terminal is electrically connected to the first terminal. A third terminal is formed in a second side of the interposer. The third terminal is electrically connected to the outer connector. A fourth terminal is formed in a third side of the interposer. The fourth terminal is electrically connected to the controller chip. |
