发明名称 Air-gap type thin-film bulk acoustic resonator and fabrication method therefor
摘要 An air-gap type thin-film bulk acoustic resonator has a substrate having a cavity formed on a predetermined portion of an upper surface thereof; a resonance part having a structure of a first electrode, a piezoelectric substance, and a second electrode deposited in order and formed over the upper side of the cavity; and at least one via hole penetrating a lower surface of the substrate and connecting to the cavity. <IMAGE>
申请公布号 EP1598933(B1) 申请公布日期 2009.08.12
申请号 EP20050253013 申请日期 2005.05.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SONG, IN-SANG;HA, BYEOUNG-JU;PARK, YUN-KWON;KIM, JONG-SEOK
分类号 H01L41/09;H03H9/17;H01L41/187;H01L41/22;H03H3/02;H03H9/24;H03H9/56 主分类号 H01L41/09
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