PROCESS FOR PRODUCING METAL-FILM-COATED SUBSTRATE, METAL-FILM-COATED SUBSTRATE, PROCESS FOR PRODUCING METALLIC-PATTERN MATERIAL, AND METALLIC-PATTERN MATERIAL

摘要

There are provided a metal film-carrying substrate including a substrate and a metal film with good adhesion to the substrate and being less dependent on temperature or humidity, and a method for preparation thereof. There are also provided a metal pattern material having a patterned metal portion with good adhesion to a substrate, being less dependent on temperature or humidity, and providing highly reliable insulation for a region where the patterned metal portion is not formed, and a method for preparation thereof. The method for preparing the metal film-carrying substrate includes: (a1) forming a polymer layer on a substrate, the polymer layer including a polymer that has a non-dissociating multidentate functional group capable of interacting with a plating catalyst or a precursor thereof and is directly and chemically bonded to the substrate; (a2) applying a multidentate plating catalyst or a precursor thereof to the polymer layer; and (a4) performing plating on the multidentate plating catalyst or precursor thereof; and (a3) optionally adding a metal to the polymer layer after the step (a2), the metal being different from the multidentate plating catalyst or precursor thereof.