| 摘要 |
<p>A 3D smart power module is provided to reduce a size of a package by installing a power device and an IC control device in a first semiconductor device and a second semiconductor device. A heat sink includes a plurality of conductive regions. A die bond surface has each conductive region. A first semiconductor device is die-bonded on the die bond surface. A printed circuit board(180) includes a plurality of lower traces and a plurality of upper trances. The lower trace is formed in a first surface of the printed circuit board. The upper trace is formed in a second surface of the printed circuit board. The first semiconductor device is adhered to the lower trace. A plurality of vias are formed in the printed circuit board. The via connects the upper trace and the lower trace. The second semiconductor device is adhered to the upper trace. An external pin is adhered to the upper trace.</p> |
