| 发明名称 |
FLEXIBLE SUBSTRATES HAVING A THIN-FILM BARRIER |
| 摘要 |
Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature. |
| 申请公布号 |
EP2087538(A2) |
申请公布日期 |
2009.08.12 |
| 申请号 |
EP20070870912 |
申请日期 |
2007.11.26 |
| 申请人 |
CORNING INCORPORATED |
发明人 |
AITKEN, BRUCE G.;BOOKBINDER, DANA C.;GARNER, SEAN M.;QUESADA, MARK A. |
| 分类号 |
H01L51/52 |
主分类号 |
H01L51/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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