| 摘要 |
It is an object of the present invention to provide an IC socket that has a configuration to promote heat dissipation from an IC device in a simple configuration, and prevent overheating of the IC device under test. Contact pins 6c, similar to the contact pins 6a and 6b, are disposed in regions not corresponding to the signal balls 51 and the thermal balls 52 of the BGA device 5. Further, the contact pins 6c and the second contact pins 6b that are contacted to the thermal balls 52 are thermally connected to each other via a heat spreader. |
