| 摘要 |
The invention relates to a method for forming a relief layer (216) employing a stamp (206) having a stamping surface (208) including a template relief pattern. A solution comprising a siliconoxide compound (200) is sandwiched between a substrate surface (202) and the stamp surface (208) and dried while sandwiched. After removal of the template relief pattern the relief layer obtained has a high inorganic mass content making it robust and directly usable for a number of applications such as semiconductor, optical or micromechanical. |
