| 摘要 |
A heat sink for a semiconductor is provided to improve heat discharging efficiency by forming an external heat sink and an internal heat sink dually. A heat sink(5) is attached to both sides of a semiconductor module(100) and discharges the heat of the semiconductor module. The heat sink includes an inner heat sink(10) and an external heat sink(20). The internal heat sink is attached to the semiconductor module. The external heat sink is integrated with the internal heat sink and is curve-cut. A space is formed between the internal heat sink and the external heat sink. A plurality of heat dissipation pieces(30) are formed in a part of the internal heat sink and the external heat sink. |
