发明名称 |
Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device |
摘要 |
A semiconductor device wherein an electrode pad to be contacted a test probe for performing probe testing, a bonding area mark for defining a bonding area which performs wire boding on the electrode pad, and a probe area mark for defining a probe repair area for repairing or replacing the test probe for the electrode pad.
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申请公布号 |
US7573280(B2) |
申请公布日期 |
2009.08.11 |
申请号 |
US20080068815 |
申请日期 |
2008.02.12 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
JIMI JUNICHI |
分类号 |
G01R31/02 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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