发明名称 |
Carbon containing nickel particle and conductive paste |
摘要 |
Carbon-containing nickel-particle powder is provided. The carbon-containing nickel-particle powder has improved shrinkage property when fired due to the presence of carbon. Also, the carbon-containing nickel-particle powder has a very restricted degree of forming agglomerates.
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申请公布号 |
US7572314(B2) |
申请公布日期 |
2009.08.11 |
申请号 |
US20070822639 |
申请日期 |
2007.07.09 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI JAE-YOUNG;KIM SOON-HO;KIM TAE-KYOUNG;LEE HAK-JOON;YOON SEON-MI |
分类号 |
B22F1/02;B22F9/24;B22F1/00;C22C1/00;C22C19/03;H01B1/02;H01B1/22;H01B1/24;H01B5/00;H01B13/00;H01G4/12;H01G4/30 |
主分类号 |
B22F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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