发明名称 WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 A capacitor (350) is formed of a dielectric layer (330), and a first electrode (310) and a second electrode (320), which confront each other across a dielectric layer (300). The capacitors (350) are laminated on a capacitor laminated body (450) through adhesive (340). A wiring board (900) is provided with a first resin insulating layer (200a) incorporating the capacitor laminated body (450), a first via conductor (411) which electrically connects the first electrodes (310), a second via conductor (412) which electrically connects the second electrodes (320), a first external terminal (427P) which is electrically connected to the first via conductor (411) and a second external terminal (427G) which is electrically connected to the second via conductor (412). The first electrode (310) and the second electrode (320) are dislocated and arranged in a face direction of the electrodes. ® KIPO & WIPO 2009
申请公布号 KR20090086023(A) 申请公布日期 2009.08.10
申请号 KR20087028270 申请日期 2007.11.02
申请人 IBIDEN CO., LTD. 发明人 YOSHIKAWA KAZUHIRO
分类号 H05K1/18;H01G4/002 主分类号 H05K1/18
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