PRINTED CIRCUIT BOARD FOR PREVENTING OVERLAP OF GOLD WIRE USING SEMICONDUCTOR PACKAGE MOLDING

摘要

A printed circuit board is provided to prevent deformation of a gold wire by efficiently exhausting an air and a gas in a molding process. A printed circuit board(100) includes a block region. A plurality of semiconductor chips is attached inside the block region. A plurality of semiconductor chips is sealed by one mold body. An air vent(165) is formed in the other side of the printed circuit board in order to exhaust an air and a gas to outside in a molding process. The air vent is formed by removing a part of a solder resist(160) formed on a side of the printed circuit board. A part of the air vent is extended from the side of the printed circuit board to an inner part of the block region.