SEMICONDUCTOR PACKAGE AND METHODS FOR FABRICATING THE SAME

摘要

A semiconductor package and method for fabricating the same are provided to realize high electric resistance and low thermal resistance property by using a polymer layer as an insulation structure. In a semiconductor package and method for fabricating the same, a lead frame(110) comprises a base plate(110a) and a lead(110b). A Polymer layer pattern(210a) is adhered to the base plate, and a metal layer pattern(220a) is formed on the polymer layer pattern. A semiconductor chip(250a) is set on the metal layer pattern.