PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A printed circuit board and a manufacturing method thereof are provided to form a fine circuit pattern on an insulation layer by increasing an adhesive force between the circuit pattern and the insulation layer. A seed layer is formed on an insulation layer by electroless plating. A plating resist layer is formed on a surface of the seed layer except for a part for forming a circuit pattern. The circuit pattern is formed on the seed layer by electroplating(S110). The plating resist layer is removed. The circuit pattern and the seed layer corresponding to the circuit pattern are buried by press or vacuum laminator(S120). The exposed seed layer is removed by flash etching(S130).