| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for manufacturing a semiconductor, capable of suppressing deterioration of yield by suppressing wafer jumping or breaking due to warping by thermal stress, in a MSA process. SOLUTION: A supporting member 15 for supporting a wafer w is arranged on a stage 14. An upper end of the supporting member 15 is adjusted at a height where the wafer w is detached from the stage 14 when warping of the wafer w under a predetermined condition becomes maximum. The wafer w is supported at the upper end of the supporting member 15. The wafer w is annealed by using a lamp 12 under a predetermined condition. COPYRIGHT: (C)2009,JPO&INPIT |
