发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To enhance the resolution of a surface shape to be detected in a semiconductor device for acquiring the surface shape of an object to be measured. SOLUTION: A first capacity detector circuit layer 20 and a second capacity detector circuit layer 30 provided with individual elements 29, 38 for detecting the capacitances between the object to be measured 60 and individual electrodes 28, 37, are laminated, and each electrode 28, 37 of each element 29, 38 is extended up to a protection layer 50 by each trench 26, 35. Thereby, the number of elements 29, 38 arrangeable per predetermined area can be increased as compared to the case where the device has only one capacity detector circuit layer, and the surface shape of the object 60 can be detected with higher resolution. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009174903(A) 申请公布日期 2009.08.06
申请号 JP20080011486 申请日期 2008.01.22
申请人 DENSO CORP 发明人 KAJI YASUE
分类号 G01B7/28;G06T1/00;H01L21/822;H01L21/8234;H01L27/00;H01L27/04;H01L27/06;H01L27/088 主分类号 G01B7/28
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