发明名称 METHOD OF MANUFACTURING MATERIAL TO BE ETCHED
摘要 A method is provided, of manufacturing a material to be etched that can more preferably prevent a region to be etched from remaining as an un-etched region and reduce deviation of etched/un-etched regions. Patterning (a method of manufacturing a material to be etched) of a substrate 100, which is manufactured by performing etching through an opened region 10 by an etching mask M1, is performed by a first etching process and a second etching process that is performed after the first etching process. The second etching process is a process for etching a region including a region that is not etched by the first etching process. An un-etched region, which is the same as etched using a virtual etching mask M1', is formed on the surface of an object to be etched by the first and second etching processes.
申请公布号 US2009197353(A1) 申请公布日期 2009.08.06
申请号 US20060065755 申请日期 2006.08.25
申请人 PIONEER CORPORATION 发明人 YOSHIZAWA TATSUYA;NAGAYAMA KENICHI;HATAKEYAMA TAKUYA
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
主权项
地址