发明名称 HOUSING BONDING METHOD OF ACOUSTIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a housing bonding method of an acoustic module capable of easily ensuring air tightness of housings and preventing air from being leaked from an acoustic pipe. SOLUTION: In the housing bonding method of the acoustic module MJ including: a housing A1 constituted of a body A10 and a cover A11 that are resin molded members; a speaker SP which is mounted on the housing A1 to output sounds from the front face side of a diaphragm 23 to the outside of the housing A1; a rear air chamber Br, that is a space within the housing A1, formed at a rear face side of the diaphragm 23 of the speaker SP; and an acoustic pipe 40 formed within the housing A1 by abutting the end face of a wall portion 41 erected on the inner face of the body A10 on the inner face of the cover A11, in a state where bonding faces of the body A10 and the cover A11 are brought into contact with each other, ultrasonic vibration is applied to either the body A10 or the cover A11, thereby fusing the bonding faces each other. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009177744(A) 申请公布日期 2009.08.06
申请号 JP20080016879 申请日期 2008.01.28
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 KITADA KOSAKU;KIMOTO SHINYA;AKASAKA OSAMU;ARIKAWA YASUSHI;YOSHIDA KEIICHI
分类号 H04R1/02;H04R1/28 主分类号 H04R1/02
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