LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
摘要
Provided are a light emitting device package and a method for fabricating the same. The light emitting device package comprises a substrate; a light emitting device on the substrate; a zener diode comprising a first conductive type impurity region and two second conductive type impurity regions, the first conductive type impurity region being disposed in the substrate, the two second conductive type impurity regions being separately disposed in two areas of the first conductive type impurity region; and a first electrode layer and a second electrode layer, each of them being electrically connected to the second conductive type impurity regions and the light emitting device.
申请公布号
WO2009057983(A3)
申请公布日期
2009.08.06
申请号
WO2008KR06473
申请日期
2008.11.03
申请人
LG INNOTEK CO., LTD;KIM, GEUN HO;SONG, YONG SEON;WON, YU HO