| 摘要 |
<p>Provided is a chip-type semiconductor ceramic electronic component having a ceramic body composed of a semiconductor ceramic, first external electrodes formed on the both end surfaces of the ceramic body, and second external electrodes extending to cover the surfaces of the first external electrodes and a part of a side surface of the ceramic body. The electronic component has a small resistance value variance and a small thermal shock resistance change, and in the electronic component, excellent substrate mounting is performed. When a curvature radius of a corner section of the ceramic body is expressed by R(µm), the maximum thickness of a layer brought into contact with the ceramic body, among the first external electrode layers, from an end surface of the ceramic body is expressed by y (µm), and the minimum thickness of a layer brought into contact with the side surfaces of the ceramic body, among the second external electrodes, from the apex of the corner section of the ceramic body is expressed by x (µm), an inequality of 20=R=50 is satisfied, and when 0.5=x=1.1, an inequality of -0.4x+0.6=y=0.4 is satisfied, and when 1.1=x=9.0, an inequality of -0.0076x+0.16836=y=0.4 is satisfied.</p> |
