PROCESS FOR ADSORBING PLATING CATALYST, PROCESS FOR PRODUCTION OF SUBSTRATE PROVIDED WITH METAL LAYER AND PLATING CATALYST FLUID FOR USE IN BOTH PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a process for selectively adsorbing a plating catalyst only to the desired region of a substrate at which a hydrophobic plating catalyst receiving region is formed, and to provide a process for the production of a substrate provided with a metal layer using the same.

SOLUTION: Disclosed is a process for adsorbing a plating catalyst which comprises the step of applying a photosensitive resin composition which contains a compound bearing both a polymerizable group and a group interactive with a plating catalyst and in which a cured material is a hydrophobic surface, the step of subjecting the resulting substrate to patternwise light exposure to cure the composition, the step of subjecting the resulting substrate to development to remove uncured part of the composition, and the step of bringing an aqueous plating catalyst fluid containing both a plating catalyst and an organic solvent into contact with the resulting substrate, wherein when being contacted with the catalyst fluid containing palladium as a plating catalyst, provided that an adsorption in a plating catalyst receiving area as Amg/m2and an adsorption in a non-formed region as Bmg/m2, formulae (A):10 mg/m2≤A≤150 mg/m2and formula (B):0 mg/m2≤B≤5 mg/m2are satisfied.

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