| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To standardize a lead frame for a semiconductor apparatus having a single package wherein a plurality of semiconductor chips are mounted. <P>SOLUTION: The semiconductor apparatus includes: a microcomputer chip 2 (first semiconductor chip) having a plurality of pads 2c (first terminals); a memory chip 3 (second semiconductor chip) having a plurality of pads 3c (second terminals) arranged beside the microcomputer chip 2; a die pad 5c (first chip mounting portion) smaller than the dimension of the microcomputer chip 2; a suspension lead 5d; a bar die pad 5e (second chip mounting portion) extending in the direction wherein the memory chip 3 is arranged from the suspension lead 5d; a plurality of wires 6a (first wires) that connect the pad 2c and pad 3c; and a sealing body 4. In the mounting surface of the microcomputer chip 2 and memory chip 3, the region wherein the pad 2c and the pad 3c are overlapped in the thickness direction are required to be arranged so as to avoid the die pad 5c and the bar die pad 5e respectively. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
