| 摘要 |
PROBLEM TO BE SOLVED: To provide a tinned strip suitable as a conductive spring material of a connector, a terminal, a relay, switch or the like and having excellent wear resistance. SOLUTION: The plated strip is formed by electroplating an undercoat and Sn plating in this order on the surface of a copper alloy strip and after that applying reflow treatment, wherein the average nitrogen concentration in a Cu-Sn alloy layer is 0.01-0.1 mass%, the thickness of the Cu-Sn alloy layer is 0.4-2.0μm, the thickness of pure Sn is≥0.5μm and a relationship among the Vickers hardness of a base material, the thickness (μm) of the Cu-Sn alloy layer obtained after the reflow and the average nitrogen concentration (mass%) of the Cu-Sn alloy layer satisfies (thickness of the Cu-Sn alloy layer)>2.63-0.008×(Vickers hardness of the base material)-9×(average nitrogen concentration). When a base is Cu, it is preferable that the thickness of the Sn layer is 0.5-1.5μm and the thickness of the Cu layer is 0-0.8μm, and when the base is Ni, it is preferable that the thickness of the Sn layer is 0.5-0.8μm and the thickness of the Ni layer is 0.1-0.8μm. COPYRIGHT: (C)2009,JPO&INPIT
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