| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve connection of a semiconductor chip and an optical fibre, and make it possible to convert an electrical signal to light at high speed between the semiconductor chip and the optical fibre just under the semiconductor chip, and to convert input light to the electrical signal. <P>SOLUTION: The device prepares: a semiconductor chip 10 which includes a transmission unit and a receiving unit for wireless communication connected to antenna elements 12, 13; and a wireless optical chip substrate 20 which includes a transmission unit and a receiving unit for wireless communication connected to antenna elements 22, 27, includes optical elements for optical communication connected to the transmission unit and the receiving unit for optical communication, and mounts the semiconductor chip 10. The device is composed so that the semiconductor chip 10 is mounted on the wireless optical chip substrate 20 so that the antenna elements 12, 13 of the semiconductor chip 10 and the antenna elements 22, 27 on an RF-OPT chip 21 face each other. <P>COPYRIGHT: (C)2009,JPO&INPIT |
