| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit element forming method for eliminating contamination due to the adhesion of the adhesive of a dicing tape to a chip even when dissolving in a solvent an adhesive with which a support plate for supporting the circuit (element) forming face of a semiconductor wafer is adhered when grinding and making thin the back face of the substrate. <P>SOLUTION: This circuit element forming method includes: adhering a support plate having stiffness to the surface of a substrate on which a circuit is formed with adhesive; grinding and making thin the back face of the substrate in this state; forming a through-electrode on the thin back face of the substrate; dicing this substrate into individual small pieces; adhering a dicing tape to the through-electrode side of the elements diced into small pieces; irradiating the dicing tape with UV light; bringing solvent supplied to a plurality of through-holes formed in the thickness direction of the support plate into contact with the adhesive between the support plate and the substrate to dissolve the adhesive; and peeling the support plate from the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT |
