| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper wiring insulation film using a semi-additive method, which suppresses the occurrence of connection failure or wiring fall when mounting chips such as IC chips using a carrier-equipped copper foil laminate insulation film, and is applicable to a fine-pitch wiring. <P>SOLUTION: The method for manufacturing a copper wiring insulation film using a semi-additive method uses a carrier-equipped copper foil laminate insulation film in which a carrier-equipped copper foil having 0.5-5 μm thickness of a copper foil is laminated on a signal surface or both surfaces of an insulation film. The insulation film obtained by removing the undulation on the surface of the copper foil on a side laminated on the insulation film of the copper foil or the copper foil of the copper foil laminate insulation film is selected from among following surface characteristics: (a1) the wavelength of the undulation is ≤5 μm, (b1) the wavelength of the undulation is ≥120 mm and (c1) the wavelength of the undulation is ≥5 μm and <120 mm and the amplitude thereof is ≤0.5 μm. <P>COPYRIGHT: (C)2009,JPO&INPIT |
