| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component capable of enhancing insulation between a substrate with a via hole formed thereon and a conductive member formed in the via hole. <P>SOLUTION: (a) A contact metal 20x is formed on one-side principal surface of a first substrate 20; (b) a via hole 21 is formed on the first substrate 20 to expose the contact metal 21 to a via hole bottom surface 21t; (c) the via hole inside surface 21s is etched to remove at least tip sides of protrusions 29a and 29b formed on the via hole inside surface 21s; (d) an insulation film 32 formed of an oxide film or nitride film is formed on a part contacting a via hole opening 21a, the via hole inside surface 21a and the contact metal 20x exposed to the via hole bottom surface 21t; (e) the insulation film 32 formed on the contact metal 20x is removed; and (f) a conductive member is arranged on the insulation film 32 and the contact metal 20x of the via hole bottom surface 21t with the insulation film 32 removed therefrom. <P>COPYRIGHT: (C)2009,JPO&INPIT |
