| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of dividing a wafer, using a tip dicing technique, which can improve the traverse rupture strength of a device. SOLUTION: Disclosed is the method of dividing the wafer, which divides the wafer having devices formed in a plurality of regions defined with division schedule lines formed on a surface in a lattice shape is divided into the individual devices, the method comprising the steps of: coating the surface of the wafer with a protective film; cutting the division schedule lines together with the protective film to form cut grooves having a depth corresponding to a finish thickness of the devices; removing chippings produced in the cut grooves by plasma etching; sticking a protective tape on the surface of the wafer; making the cut grooves formed on the top surface of the wafer appear on the backside of the wafer by grinding the backside to divide the wafer into the individual devices; and removing grinding strain from the backside of the wafer. COPYRIGHT: (C)2009,JPO&INPIT
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