| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an inlet for improving bonding quality by ultrasonic bonding of a bump of IC chip on an antenna provided on a base material for inlet when the base material for inlet is formed of a soft material. <P>SOLUTION: In the method of manufacturing the inlet 10, the base material 11 for inlet is prepared first on which the antenna 12 is provided on its one surface. Next, the base material 11 for inlet with the antenna 12 is arranged on a receiving board 21 with the surface in the side of antenna 12 directed upward. Next, the bump 13a of the IC chip 13 is bonded with ultrasonic wave on the antenna 12, while a pair of terminal edges 11a opposing to the base material 11 for inlet are pulled in both directions. <P>COPYRIGHT: (C)2009,JPO&INPIT |
