| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode package capable of embodying flexibility of design and arrangement, expansion of a directivity angle, lightweight, thinning, and downsizing in the manufacturing of a light source package using a light-emitting diode, and to provide the method of manufacturing the light-emitting diode package. <P>SOLUTION: The method of manufacturing the light-emitting diode package includes: a step of putting a thermoplastic high molecular substance into a previously manufactured metal mold and molding it to manufacture a package body with a plurality of cavities formed in a line on one surface; a step of forming an electrode penetrating the package body; a step of mounting a light-emitting diode chip on each basal surface of each of the cavities formed in the package body; a step of electrically connecting a light-emitting diode chip to the electrode by using a bonding means; and a step of sealing the light-emitting diode chip and the bonding means by using molding resin. <P>COPYRIGHT: (C)2009,JPO&INPIT |
