| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a compact three-dimensional module that can control impacts on function elements such as a microelectromechanical system (MEMS), etc. <P>SOLUTION: A boards joining member 21 for joining an electrode board 30 and a drive board 40 has a conductive stress absorption member 46 and a stress absorption joining member 60, wherein the conductive stress absorption member 46 electrically joins the electrode substrate 30 and the drive board 40. When the drive board 40 warps, for example, by heat, external force, etc., and stress arises to the drive board 40, the member 46 is transformed in a desired direction to absorb this stress, while the stress absorption joining member 60 mechanically joins the electrode board 30 and the drive board 40. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
