| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connecting method of a connector which stably attains better connection strength, and to provide a connection structure using the connecting method. <P>SOLUTION: In the connecting method of the connector, the connector 2 having a connecting face 21 at one end of a curved shape is connected onto a semiconductor chip 1 face to face using solder 3, wherein the semiconductor chip is parallel with the connecting face, and includes a wider fitting face 11 than the connecting face. The connecting method includes a process to prepare such connector as at lease an area and a deadweight of the connecting face are considered to secure buoyancy in the solder with a predetermined amount melted, a process to apply plating 24 to the connecting face, wherein the plating includes better affinity with the solder than the prepared connector, and a process to fit the connector with the plating applied to the fitting face of the semiconductor chip using the solder. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
