| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit in which a conductor path liner and a via liner suitable for improving electrical properties, especially service life or reliability of the integrated circuit, are brought into contact. SOLUTION: In particular, the integrated circuit in which the via liner 28 and the conductor path liner 20 are brought into contact. The via liner 28 is a connecting section intermediate material which is arranged in each case between connecting section and the connecting section dielectric, and/or between the connecting section and interconnect. The conductor path liner 20 is electrically conductive interconnect intermediate material which is arranged in each case between the side area of interconnect and the interconnect dielectric. The interconnect intermediate material and the connecting section intermediate material are brought into contact with one another at least one connection. This contact improves the electrical properties, especially the service life or reliability of the integrated circuit 10. COPYRIGHT: (C)2009,JPO&INPIT |
