| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cooling apparatus suppressing the occurrence of a burn-out state and to improve the cooling performance, by providing fins on a surface of a cooling plate opposite to a cooling face of the cooling plate to which a semiconductor is jointed. <P>SOLUTION: In this cooling apparatus, on a surface of a cooling plate 2 opposite to a cooling face S of the cooling plate to which a semiconductor element 5 is jointed, plate-shaped fins 10 extended across a coolant path 4 are provided. The plate-shaped fin 10 comprises a base part 12 and pins 14, extending in a pectinate shape from the base part and aligned in the flow direction of a coolant with an interval d causing a capillary phenomenon of the coolant. Groove parts 20 are formed by the base part 12 of plate-shaped fins 10 adjacent to each other. Although air bubbles are generated on a bottom wall of the groove part 20 by a heat from the semiconductor element, the coolant is supplied continuously to the interface of air bubbles through a capillary phenomenon so that not only nuclear boiling state is maintained, since a burn-out state can be suppressed, as much as possible, the cooling apparatus can be cooled efficiently. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
