发明名称 |
Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them |
摘要 |
A fabrication method for a metal-base/polymer-resin bonded structured body according to the present invention includes the steps of: (1) applying, to a surface of the metal base, a solution containing an organometallic compound decomposable at 350° C. or lower; (2) baking the applied solution in an oxidizing atmosphere to form, on the surface of the metal base, a coating containing an oxide of the metal of the organometallic compound; (3) providing the polymer resin on the coating; and (4) hardening the polymer resin to provide the metal-base/polymer-resin bonded structured body. |
申请公布号 |
US2009197375(A1) |
申请公布日期 |
2009.08.06 |
申请号 |
US20090320559 |
申请日期 |
2009.01.29 |
申请人 |
HITACHI, LTD. |
发明人 |
KAJIWARA RYOICHI;MOTOWAKI SHIGEHISA;ITOU KAZUTOSHI;HOZOJI HIROSHI |
分类号 |
H01L21/02;B05D3/02;B05D3/06;B32B15/01;H05H1/00 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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