| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component for a substrate treating apparatus in which the production of particles caused by the breakage of an alumite film is surely prevented. <P>SOLUTION: A cooling plate 36 of the component for the substrate treating apparatus 10 for applying plasma on a wafer W includes an aluminum base material 56 consisting essentially of an alloy containing silicon in aluminum and the alumite coating film 57 formed on the surface of the aluminum base material 56 by connecting the cooling plate 36 to an anode of a power source and dipping into a solution consisting essentially of oxalic acid to carry out an anodizing treatment. The alumite coating film 57 is impregnated with ethyl silicate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
