| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film circuit board which can secure high size stability even with a thin base material by making only a necessary portion of the base material into a thin film and also can secure high adaptability to a bonded electronic device etc., and which has superior bendability and flexibility on the whole, and to provide a method of manufacturing the same. SOLUTION: In the polyimide circuit board and method of manufacturing the same, after a metal wiring circuit pattern is formed on both surfaces or one surface of a copper-clad base material by a semiadaptive method or subtractive method, the metal wiring circuit pattern is coated and reinforced with a heat-resistant insulating resin and further a polyimide base material portion where no metal wiring circuit is formed is made into a thin film through chemical etching to form a polyimide insulating layer which is different in film thickness in the same board. COPYRIGHT: (C)2009,JPO&INPIT
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