| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of producing a wiring circuit board, for definitely electrically connecting the first terminal of the first flexible wiring circuit board to the second terminal of the second flexible wiring circuit board. SOLUTION: The method of producing the wiring circuit board includes: a process for disposing the first flexible wiring circuit board 1 and the second flexible wiring circuit board 8 in a manner that the first terminal 5 and the second terminal 12 are opposing each other and for interposing an adhesive agent layer 15 composed of a solder bump 14 and a B stage resin in between those; a process for primary heating under pressure in the temperature range which exceeds the temperature of the adhesive agent layer 15 to become the B stage resin and is below the hardening temperature and also below the melting temperature of the solder bump 14; and a process for secondary heating at a temperature above the hardening temperature of the adhesive agent layer 15 and also above the melting temperature of the solder bump 14. COPYRIGHT: (C)2009,JPO&INPIT
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