METHOD FOR PRODUCING AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT

摘要

The invention relates to a method for producing an electronic component that comprises barrier layers for encapsulating the component, comprising the following steps: making available a substrate (1) having at least one functional layer (22), applying at least one first barrier layer (3) to the functional layer (22) by way of plasma-less atomic layer deposition (PLALD) and applying at least one second barrier layer (4) to the functional layer (22) by way of plasma-enhanced chemical vapor deposition (PECVD).