Verfahren zur Herstellung eines Leistungshalbleitermoduls mit biegesteifer Grundplatte

摘要

The device has a metal base plate (20) for mounting on a cooling body (80) with a frame-shaped housing (30), a cover (70), outward-leading connection elements and at least one insulating substrate (50) in the housing with an insulating body, connecting tracks (54) on a main surface facing the base plate, connected power semiconducting components and a metal coating on a second main surface. The base plate has a stiffening structure (24a) in the longitudinal direction formed from the base plate material by deformation.