| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a base material with a junction film which can be strongly and efficiently joined to an adherend with high dimensional accuracy at a low temperature, to provide a method for efficiently joining the base material with the junction film to an adherend at a low temperature, and to provide a junction structure having high reliability comprising the above base material with the junction film and an adherend strongly joined to each other with high dimensional accuracy. <P>SOLUTION: The base material with a junction film comprises a base sheet 2 (base material) and, superimposed on the base sheet 2, a junction film 3 so as to be joinable with an opposite base sheet 4 (another adherend). This junction film 3 contains an Si skeleton of random atomic arrangement having a siloxane (Si-O) bond, and a leaving group bonded to the Si skeleton, wherein the Si skeleton has a crystallization degree of being not more than 45%. The junction film 3 enables the leaving group to leave from the Si skeleton when irradiated with UV rays, which develops adherence to the opposite base sheet 4 on the surface 35 of the junction film 3. <P>COPYRIGHT: (C)2009,JPO&INPIT |
