| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a mounting substrate, by which a linear mounting substrate can be obtained without causing any warpage and burr. <P>SOLUTION: When the linear mounting substrate 11 is manufactured which includes a laminate portion 18 having a substrate body 12 made of metal, an insulating layer 13 formed on the upper side of the substrate body 12, a circuit pattern 14 formed on the upper side of the insulating layer 13 and made of metal, and the laminate portion 18 formed on the upper side of the circuit pattern 14 and having a surface layer 15 made of an insulator. A plurality of linear laminate portions 18 are formed on one metal plate successively leaving a gap along the width, and the part of the gap of the laminate portions 18 on the metal plate is removed through etching. <P>COPYRIGHT: (C)2009,JPO&INPIT |
