| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device that has a structure, in which multiple photodetection elements each independently detecting a light beam emitted from one of multiple light-emitting elements are integrated into a package, and that can prevent the reduction in detection accuracy of each photodetection element resulting from leak current between the photodetection elements. <P>SOLUTION: In a light-emitting device, a package 2 includes: a mounting substrate 2a where housing recesses 2b for housing multiple LED chips (light-emitting elements) 1a through 1d are formed on one surface thereof; and a photodetection element formation substrate 40 that is formed by using a silicon substrate (semiconductor substrate) 40a and is bonded to the one surface side of the mounting substrate 2a. The photodetection element formation substrate 40 has a light extracting hole 41 in communication with the housing recesses 2b and light-receiving surfaces that are formed for the respective photodetection elements and are provided around the light extracting hole 41 on the surface side facing the housing recesses 2b, and is split into small pieces 42 each having one photodetection element by multiple splitting slits 49 formed so as to be spaced apart from each other in a circumferential direction of the light extracting hole 41. <P>COPYRIGHT: (C)2009,JPO&INPIT |
