SUBSTRATE GRIPPER AND SUBSTRATE CARRYING ROBOT WITH THE SAME, AND SEMICONDUCTOR PRODUCTION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate gripper thinning the whole thickness of a hand and being miniaturized and lightened. SOLUTION: The substrate gripper includes a baseplate 11 divided into two from the base end side to the front end side, a gripping plate 12 fitted to the top face of the baseplate 11 and a gripping driving section 7 fitted between the baseplate 11 and the gripping plate 12. The substrate gripper further includes: a gripping section 10 consisting of the front end of a forked base end and the front end of the gripping plate 12; and guide sections 20 guiding a substrate partially at each front end of a fork. The gripping driving section 7 is composed of: an biasing means 15 for biasing the base end side to the upper side at all times on the base end side of the gripping plate 12; and an electromagnet section 14 for attracting the gripping plate 12 to the baseplate 11 side by an electrical conduction in the vicinity of the biasing means 15. The gripping driving section 7 is further composed of a bearing section 13 vertically oscillating the gripping plate 12 to the baseplate 11 on the front end side. The guide sections 20 have guide grooves 23 where the guide sections 20 can abut on the surface, rear and side face of the periphery of part of the substrate at its front ends. COPYRIGHT: (C)2009,JPO&INPIT