发明名称 |
TEMPERATURE CONTROL MECHANISM, AND PROCESSING DEVICE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a temperature control mechanism capable of performing the temperature control of a chamber wall or the like of a processing device with high accuracy, and to provide a processing device using the same. SOLUTION: The temperature control mechanism 50 includes: a plurality of heater units 51 for respectively heating a plurality of areas 55 obtained by demarcating a wall part of a housing 2 of a chamber 1; a plurality of heater power sources 52 for respectively supplying power to the plurality of heater units 51; a plurality of thermostats 53 for respectively measuring the temperature of the plurality of areas 55; and a plurality of controllers 54 for controlling the corresponding power supply units so that the temperature of the corresponding area is the predetermined target value by the ILQ (Inverse Linear Quadratic) control based on the signal of each temperature sensor. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009173969(A) |
申请公布日期 |
2009.08.06 |
申请号 |
JP20080011728 |
申请日期 |
2008.01.22 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
TIAN CAI ZHONG;ISHIBASHI KIYOTAKA;NOZAWA TOSHIHISA |
分类号 |
C23C16/44;H01L21/205;H01L21/3065 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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