| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for use in semiconductor encapsulation which ensures such a flame resistance in a thin-wall molded article as is the basic performance in the semiconductor device and besides which is excellent in the high temperature characteristics and has the higher environmental performance, and to provide a semiconductor device using it. SOLUTION: The epoxy resin composition has the essential components of an epoxy resin, a hardener and an inorganic filler, and the above hardener shall contain an aminotriazine-type phenol novolac resin expressed by formula (1) (wherein, R<SB>1</SB>is hydrogen, a methyl group or a methylphenol group; and R<SB>2</SB>is hydrogen, an amino group or an aminomethylphenol group). COPYRIGHT: (C)2009,JPO&INPIT
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