发明名称 GLASS PASTE FOR DIELECTRIC LAYER
摘要 PROBLEM TO BE SOLVED: To provide glass paste for a dielectric layer, which has excellent thermal decomposability, dispersibility of glass powder and printability, and exhibits a good performance when it is used to form a dielectric layer. SOLUTION: The glass paste for a dielectric layer is used for forming a dielectric layer and contains a binder resin, lead-free glass fine particles and an organic solvent. The binder is composed of a (meth)acrylic copolymer and ethylcellulose, and the (meth)acrylic copolymer contains a segment originating from isobutyl methacrylate in an amount of 40-95 wt.% and a segment originating from polyoxyalkylene ether monomethacrylate in an amount of 5-40 wt.%. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009173811(A) 申请公布日期 2009.08.06
申请号 JP20080015485 申请日期 2008.01.25
申请人 SEKISUI CHEM CO LTD 发明人 MIYAZAKI HIROKO;FUKUI KOJI;YAMAUCHI KENJI
分类号 C08L33/12;C08K3/40;C08L1/08 主分类号 C08L33/12
代理机构 代理人
主权项
地址