发明名称 THERMOSETTING RESIN COMPOSITION FOR OPTICAL MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, which is excellent in extrusion moldability and mold releasing properties from a die, causes no deterioration in optical performance even in a high-temperature environment, and has excellent heat resistance, for optical materials. SOLUTION: The thermosetting resin composition for optical materials contains a specific bisphenol-formaldehyde resin (A) having a methylol group, and an epoxy resin (B) having two or more glycidyl groups in one molecule. A compounding ratio, as a mass ratio, of the bisphenol-formaldehyde resin (A) to the epoxy resin (B) is 70/30-30/70. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009173762(A) 申请公布日期 2009.08.06
申请号 JP20080013210 申请日期 2008.01.24
申请人 GUN EI CHEM IND CO LTD 发明人 TAIHICHI TAKESHI;KOGURE YOSHIAKI;UEHARA SOJI;YOSHIMURA MASAJI
分类号 C08G59/62;C08L63/00 主分类号 C08G59/62
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