| 摘要 |
PROBLEM TO BE SOLVED: To provide an underfill agent excellent in adhession to a copper bump. SOLUTION: The underfill agent composition contains 50 to 500 pts.mass inorganic filler (C) and 1 to 30 pts.mass compound (D) having 3-mercaptopropionyloxy group both to 100 pts.mass sum total of an epoxy resin (A) and a curing agent (B) which has a ratio [an equivalent of an epoxy group in the component (A)/an equivalent of a group reactive with the epoxy group in the component (B)] of 0.7 to 1.2. COPYRIGHT: (C)2009,JPO&INPIT
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