| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a semiconductor thin film capable of suppressing a decrease in mobility by heating and deterioration of characteristics and capable of obtaining a semiconductor thin film for improving heat resistance with a simple procedure. SOLUTION: A solution, where a plurality of kinds of organic materials, including an organic semiconductor material are mixed, is applied or printed on a substrate and a thin film is formed. Then, a plurality of kinds of organic materials are phase-separated in a step of drying the thin film. Thus, a semiconductor thin film 1 having a lamination structure wherein an intermediate layer (b) composed of an organic insulating material is sandwiched between two semiconductor layers a, a' is obtained. COPYRIGHT: (C)2009,JPO&INPIT |
